Bï¼bandwidthï¼å¸¦å®½ï¼çé¦åæ¯ã
Aï¼amplitudeï¼å¹
度ï¼çé¦åæ¯ã
CHï¼channelï¼ééï¼ç®åã
大å¤æ°é½æ¯è±æç®ç§°ï¼å 为ææ©çè¿äºè®¾å¤é½æ¯è¿å£ï¼ä½¿ç¨è±æï¼è使ç¨è
å·²ç»ä¹ æ¯äºï¼åææ¯ä¾ï¼è½ç¶ç°å¨å½äº§äºï¼ä½æ¯è¿æ¯æ²¿ç¨è±æçæ 注ï¼æå¤æ¯ä¸è±æåæ¶æ 注ï¼è¿ä¸ªæ
åµå°¤å
¶å¨çµåè¡ä¸å°¤ä¸ºå¸¸è§ã
常 ç¨ è± æ ç® å
Specification or Spec. ç产è§æ ¼
BOM: Bill of material æ表
S/N: Spec notice ç产注æäºé¡¹
ES: Electrical Spec çµæ°è§æ ¼
PK: Schematic çµè·¯å¾
PD: Physical dimension å¤è§å°ºå¯¸å¾
ES: Input characteristics è¾å
¥ç¹æ§
Input voltage range è¾å
¥çµåèå´
Input frequency range è¾å
¥é¢çèå´
Max. input AC current æ大è¾å
¥äº¤æµçµæµ
Inrush current (cold start) çªå¢çµæµ (å·å¼æº)
Efficiency: 60% Min. At nominal line æç: 60%,ä¸è¬çµå(æ115/230V,
é¤éå¦æ说æ)
Noise test æ讯æµè¯
Static output characteristics éæè¾åºç¹æ§
Dynamic output characteristics å¨æè¾åºç¹æ§
Rise time DCè¾åºçµåä¸åæ¶é´
Hold up time DCè¾åºçµåæç»æ¶é´
Protection: ä¿æ¤
OVP (over voltage protection) è¿çµåä¿æ¤
OPP (over power protection ) è¿åçä¿æ¤
OCP (over current protection) è¿çµæµä¿æ¤
OTP (over temp. protection) è¿æ¸©åº¦ä¿æ¤
Short circuit protection çè·¯ä¿æ¤
Hi-pot (dielectric withstand voltage) èçµåæµè¯
4.1 Primary to secondary AC TO DC å级对次级
4.2 Primary to safety ground AC TO FGããå级对å°
4.3 Secondary to safety ground DC TO FG ã次级对å°
4.4 Insulation resistanceããããããããããã ç»ç¼é»æ
4.5 Leakage currentããããããããããããããæ¼çµæµ
SPEC (è§æ ¼) 常ç¨åè¯
Model: æºç§ revision: çæ¬ issued date: åè¡æ¥æ
P/n: åå description: 说æ remark: å¤æ³¨
Reported by: èæ checked by: å®¡æ ¸ approved by: æ ¸å
2. FN (factory notice):ç产éç¥ï¼ECN (engineering change notice)å·¥ç¨åæ´éç¥
2.1 FN: Immediated change ç«å³åæ´ Running change èªç¶åæ¢
2.2 ECN: old rev. new rev. drawing no. customer alteration ref.
æ§çæ¬æ°çæ¬ å¾å· å®¢æ· åæ´ä¾æ®
3.Department é¨é¨
3.1 MFG: manufacturing
3.1.1 AI: auto insertion èªå¨æ件
3.1.2 preforming é¢å å·¥
3.1.3 SMD 表é¢é»è
3.2 QA: quality assurance
3.2.1 VQA è¿æåè´¨ä¿è¯
3.2.2 PQC,FQC å¶ç¨å管
3.2.3 Calibration , safety ä»ªæ ¡,å®è§
3.3 PE: production engineering å¶é å·¥ç¨
3.3.1 TE: test engineering æµè¯å·¥ç¨
3.3.2 ME: mechanical engineering æºæ¢°å·¥ç¨
3.3.3 IE: industrial engineering å·¥ä¸å·¥ç¨
3.4 HR: human resources 人åèµæº
3.5 Material ææ
3.5.1 PC: production control ç管
3.5.2 purchasing éè´
3.5.3 warehouse ä»åº
3.6 ENG: engineering å·¥ç¨
3.6.1 document control èµæä¸å¿
4.Safety
4.1 UL (Underwriters Laboratories) ç¾å½ä¿é©åä¼å®éªå®¤
4.2 CSA (Canadian Standards Association) å æ¿å¤§æ ååä¼
4.3 TUV å¾·å½ææ¯çæ¤åä¼
4.4 VDE å¾·å½çµæ°æ å
4.5 NEMKO æªå¨çµæ°æ å
4.6 DEMKO 丹麦çµæ°æ å
5.Other å
¶ä»
FAX( ä¼ ç ): date, to, fm, subject, dear, TKS, best regards,
FAR: issue, description, corrective action, preventive action, analysis, defect,
Failure, supplier / vendor
ISO: International Organization for Standardization å½é
æ ååç»ç»
Quality Manual: åè´¨æå
Procedure: ä½ä¸ç¨åº
6. Vocabulary:
6.1 contraction 缩å Contraction 缩å
6.2 component é¶ä»¶ AQL: accept quality lever å
æ¶æ°´å
6.3 process å¶ç¨ ATS: auto test system èªå¨æµè¯ç³»ç»
6.4 electrical çµæ° CR: critical 严é
6.5 time æ¶é´ ESD: electrostatic discharge éçµæ¾çµ
6.7 non å¨è¯ ICT: in-circuit test åºæçµæ¶ä½
6.8 color é¢è² MA: major 主è¦
MI: minor 次è¦
MRB: material review board ä¸è¯ææå®¡æ ¸ç»
NTC: negative temperature characterisçæçµé»
O/I: operation instruction å·¥ä½æ导书
PWN: pulse width modification 波宽è°æ´
S/N: series number åºå·
SMD: surface mounting device 表é¢é»è
WIP: work in progress åæå(å·¥ä½è¿è¡ä¸)
JIT: just in time
IR: infra-red 红å¤çº¿ç
PDPC: process, decision, Program, chart
QCCA: quality control Circle activities å管åæ´»å¨
CWQC: company-wide Quality control
MCR 代ç¨è¯
Component (é¶ä»¶)
Bobbin 线轴 tape è¶å¸¦
Bridge æ¡¥å¼æ´æµ tapping screw èªæ»èºä¸
Cable tie æ带 terminal 端å
Capacitor çµå®¹ transformer(XFMR) ååå¨
Case å¤å£³ transistor çµæ¶ä½
Ceramic capacitor é¶ç·çµå®¹ tube å¥ç®¡
Chip capacitor æ¶ççµå®¹ varistor çªæ³¢å¸æ¶å¨
Chip resistor æ¶ççµé» VR (variable resistance) å¯åçµé»
Choke 线å washer å«ç
Connector è¿æ¥å¨ zener é½çº³
Control board åºæ¿
Diode(dio) äºæä½ process (å¶ç¨)
Epoxy è assembly ç»ç«
Fan é£æ burn-in (B/I) å´©åº
FET å¸æçµæ¶ä½ component é¶ä»¶
Filter æ»¤æ³¢å¨ flux å©çå
Fuse clip ä¿é©ä¸åº§ function test åè½æµè¯
Fuse holder ä¿é©ä¸åº§ gravity æ¯é
Glue è¶ Hi-pot test èé«åæµè¯
Heatsink æ£çç insertion æ件
Fuse ä¿é©ä¸ ORT å¯é 度æµè¯
IC 积ä½çµè·¯ packing å
è£
Inductor çµæ solder machine é¡ç
Insulator ç»ç¼ç station ç«å«
Jumper wire 跳线 supplier/vender åå
Label æ ç¾ temperature 温度
Lock washer æ¥å°æå½¢å«ç torque æè·
NTC çæçµé» touch-up(T/U) è¡¥ç
Nut èºä¸å¸½ date code å¨æ
Output cable è¾åºçº¿ Time (æ¶é´)
Output wire è¾åºçº¿ Jan. ä¸æ
PCB çµè·¯æ¿ Feb. äºæ
Photo couple å
èåäºæä½ Mar. ä¸æ
Regulator 稳åå¨ Apr. åæ
Resistor çµé» May. äºæ
Rivet æ³é Jun. å
æ
Screw èºä¸ Jul. ä¸æ
Socket æ座 Aug. å
«æ
Solder bar é¡æ£ Sept. ä¹æ
Spring washer 弹簧å«ç Oct. åæ
Stand-off æ¯æ± Nov. åä¸æ
Star washer æå½¢å«ç Dec. åäºæ
Switch å¼å
³
CRT (cathode-ray tube) 示波å¨
Anode é³(æ£ï¼æ¿)æ
DCGP 常ç¨åè¯
COMPONERT (é¶ä»¶) 2. PROCESS (å¶ç¨)
Resistor(res) çµé» pre-forming å å·¥æå
VR(variable) å¯åçµé» component é¶ä»¶
Chip resistor` æ¶ççµé» process å¶ç¨
Capacitor(cap) çµå®¹ insertion æ件
Ceramic capacitor é¶ç£çµå®¹ solder machine é¡ç
Choke 线å gravity æ¯é
Inductor çµæ temperature 温度
Transformer(XâFNR) ååå¨ touch-up(T/U) è¡¥ç
Bobbin 线轴 burn-in(B/I) å´©åº
Fuse ä¿é©ä¸ assembly ç»ç«
Fuse holder ä¿é©ä¸åº§ torque æå
Fuse clip ä¿é©ä¸åº§ packing å
è£
RTC çæçµé» flux å©çå
Varistor çªæ³¢å¸æ¶å¨
Diode(dio) äºæä½
Photo couple å
èåäºæä½
Zener é½çº³ 3. ELECTRICAL (çµæ°)
Bridge diode æ¡¥å¼æ´æµ
Transistor çµæ¶ä½ input(I/P) è¾å
¥
IC 积ä½çµè·¯ output(O/P) è¾åº
Filter æ»¤æ³¢å¨ regulation è°æ´
FET å¸æçµæ¶ä½ specification è§æ ¼
Regulation 稳åå¨ ripple æ¶æ³¢
PCB çµè·¯æ¿ noise æ讯
Control board å°åºæ¿ noise buzz æ é³
Fan é£æ protection ä¿æ¤
Case å¤å£³ OVP è¿çµåä¿æ¤
Switch å¼å
³ OCP è¿çµæµä¿æ¤
Socket æ座 OPP è¿åçä¿æ¤
Screw èºä¸ no output(NOP) æ è¾åº
Tapping screw èªå¨èºä¸ broken/blow out (BRO) ç§æº
Nut èºå¸½ short çè·¯
Washer å«ç open å¼è·¯
Spring washer 弹簧å«ç voltage çµå
Star washer æå½¢å«ç current çµæµ
Lock washer æ¥å°æå½¢å«ç frequency é¢ç
Output wire è¾åºçº¿ load è´è½½
Output cable è¾åºçº¿ full load 满载
Cable tie æ带 low load 轻载
Connector è¿æ¥å¨ damage æå
Rivet éé oscilloscope 示波å¨
Terminal 端å test æµè¯
Stand-off æ¯æ± adjust è°æ´
Heatsink æ£çç inspection æ£éª
Insulator ç» ç hi-pot test é«åæµè¯
Tape è¶å¸¦ grounding æ¥å°
Tube å¥ç®¡
Label caution æ ç¾(è¦åæ ç¾)
Epoxy è
Glue è¶
Jumper wire 跳线
Solder bar é¡æ£
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